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    Signature(s)

    Amount
    € 200,000,000
    Countries
    Sector(s)
    Germany : € 200,000,000
    Industry : € 200,000,000
    Signature date(s)
    19/09/2022 : € 200,000,000

    Summary sheet

    Release date
    4 October 2022
    Status
    Reference
    Signed | 19/09/2022
    20210652
    Project name
    Promoter - financial intermediary
    ADVANCED SEMICONDUCTOR SILICON WAFER DEVELOPMENT
    SILTRONIC AG
    Proposed EIB finance (Approximate amount)
    Total cost (Approximate amount)
    EUR 200 million
    EUR 452 million
    Location
    Sector(s)
    Description
    Objectives

    The project relates to the RDI activities for the development of the next generation of hyper pure silicon wafers and ingots for the semiconductor industry as well as the adaptation of the promoter's state-of-the-art ingot production for most advanced wafer types. The project includes RDI activities in the promoter's RDI locations in Germany as well as the extension of the promoter's production facility in Freiberg, Germany, a cohesion region.

    The project objectives are the development of the next generation of hyper pure silicon wafers and ingots for the semiconductor industry as well as the adaptation of the promoter's state-of-the-art ingot production for the most advanced wafer types.

    Additionality and Impact

    The project contributes to the policy objective of RDI. It concerns private sector investments in R&D activities on innovative technologies and components as well as investments in innovative production lines. The project will lead to the development and deployment of innovative product and process technologies with substantial positive externalities. It will help to further develop relevant knowledge, skills and competences, strengthen the technological edge and increase collaboration between market players. These benefits are not fully captured by the project revenues, a market failure leading to underinvestment. Moreover, the project supports the strengthening of the EU's economic, social and territorial cohesion.



    The Bank's ability on the one hand to provide a financial value added and on the other hand, EIB's capacity to extend a sizeable loan from one source combined with attractive tenor and disbursement period are highly appreciated by the company and considered to be important elements in financing the project.

    Environmental aspects
    Procurement

    Semiconductor RDI and manufacturing facilities are not specifically covered by Annexes I & II of the EIA Directive 2014/52/EU amending the Directive 2011/92/EU, and therefore not subject to mandatory Environmental Impact Assessment.

    The promoter has been assessed by the EIB as being a private company not being subject to EU rules on public procurement or concessions.

    Disclaimer

    Before financing approval by the Board of Directors, and before loan signature, projects are under appraisal and negotiation. The information and data provided on this page are therefore indicative.
    They are provided for transparency purposes only and cannot be considered to represent official EIB policy (see also the Explanatory notes).

    Documents

    Environmental and Social Data Sheet (ESDS) - ADVANCED SEMICONDUCTOR SILICON WAFER DEVELOPMENT
    Publication Date
    6 Oct 2022
    Document language
    Main Topic
    Lending
    Document Number
    155864485
    Document Focus
    Environmental Information
    Project Number
    20210652
    Sector(s)
    Regions
    Countries
    Publicly available
    Download now

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