Release date: 28 November 2024
Promoter – Financial Intermediary
NXP BVLocation
Description
The project will support the promoter's research, development and innovation (RDI) investments in a wide range of semiconductor products in the area of Automotive, IoT, Mobile, and Communication Infrastructure. RDI investments will focus in particular on microcontrollers, application processors, communication processors, connectivity chipsets, analogue and interface devices, RF power amplifiers, security controllers and sensors.
Additionality and Impact
With the financing of this project, the bank supports the promoter to implement a sustainable European semiconductor RDI programme aiming at exploring new technological niches where EU can develop lasting competitive advantages and secure a technological edge over other regions. Consequently, it also supports the EU Chips Act whose scope is to strengthen the semiconductor market in the EU to ensure a secure and competitive supply of chips. The project also further advances knowledge spillovers within the sector and enhances the creation of skilled workers in the semiconductor industry. Demand for skilled labour is already high and could easily rise in the next decade.
Objectives
The aim is to develop next generation of semiconductor devices and solutions. RDI investments will contribute to build state-of-the-art European chip ecosystem and will involve investment in five EU countries.
Sector(s)
- Industry - Manufacturing
Proposed EIB finance (Approximate amount)
EUR 1000 million
Total cost (Approximate amount)
EUR 2106 million
Environmental aspects
Semiconductor RDI activities are not specifically covered by Annexes I & II of the environmental impact assessment (EIA) Directive 2011/92/EC (as amended by EIA Directive 2014/52/EU).
Procurement
The promoter has been assessed by the EIB as being a private company not being subject to EU rules on public procurement or concessions.
Status
Signed - 22/11/2024
Disclaimer
Before financing approval by the Board of Directors, and before loan signature, projects are under appraisal and negotiation. The information and data provided on this page are therefore indicative.
They are provided for transparency purposes only and cannot be considered to represent official EIB policy (see also the Explanatory notes).